Gelid Solutions Thermal paste GP-Ultimate 3 mm

• Ultimate thermal conductivity
• Electrically non-conductive
• Non-corrosive, non-hardening and non-toxic
• Perfect for M.2 memories RAM, VRM and SSDs

The state-of-the-art Thermal Pad
Thickness variants:
Single Pack (1pc included): 0.5 mm (TP-GP04-R-A), 1.0 mm (TP-GP04-R-B), 1.5 mm (TP-GP04-R-C), 2 mm (TP-GP04-R-D), 3 mm (TP-GP04-R-E)
Value Pack (2pcs included): 0.5mm (TP-VP04-R-A), 1.0mm (TP-VP04-R-B), 1.5mm (TP-VP04-R-C), 2mm (TP-VP04-R-D), 3mm (TP-VP04-R-E)

Gelid SolutionsThermal pads ' are designed to provide an excellent thermal interface to transfer heat to heatsinks when installed on PCBs with height differences and uneven surfaces, such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs andautres high-temperature SMD components. Thanks to its improved multilayer matrix, superior material composition and thermal conductivity of 15 W/mK, the GP-Ultimate 120×20 offers best-in-class performance.

GP-Ultimate 120×20 is electrically non-conductive, non-corrosive, non-curing, non-toxic and supports an extended operating temperature range from -60°C to 220°C. It features a transparent application and its dimensions of 120 x 20 mm enable it to fit the enlarged surfaces of memory modules RAM, GPU and CPU VRM circuits, M.2 SSD disks andautres densely packaged electronic devices.

• Density (g/cm3): 3.2
• Hardness (Shore): 60-70 OO
• Size (mm): 120 x 20